American Semiconductor, INC
At a glance
Employees1-19
In business since2001
HeadquartersBoise, ID
US patents22
SAM.gov UEIC1BNR9HJBQK8
CAGE code1WGA8
Incorporated inID
- advanced substrates
- chip scale packaging
- chip-on-flex assembly
- engineering
Named on the company’s own website, read JUL 29, 2026
CareersCareers page — seen SEP 8, 2026
Supplier designations
For Profit OrganizationManufacturer of Goods
Self-certified by the company in its SAM.gov registration
Patents
22 US patents granted 2002–2023, 2 of them in the five years to SEP 2025.
Semiconductors 6Basic communication processes 6Electrical machinery, apparatus, energy 4Computer technology 3Optics 1
- Method of demounting thin semiconductor devicesUS 11,735,464 · granted AUG 22, 2023
- Self-aligned printed terminals for FFC-style connectorsUS 11,088,475 · granted AUG 10, 2021
- Flexible micro-moduleUS 10,438,895 · granted OCT 8, 2019
- Flexible 3-D photonic deviceUS 9,733,428 · granted AUG 15, 2017
- Method of producing encapsulated IC devices on a waferUS 9,209,047 · granted DEC 8, 2015
Newest 5 shown · Granted to American Semiconductor, Inc. · PatentsView (USPTO), data through SEP 30, 2025 · CC BY 4.0
Their plant
| Facility | City | State | Employees | Status |
|---|---|---|---|---|
| American Semiconductor, INC | Boise | ID | 1–19 | ACTIVE |
Compiled from federal records — EPA, OSHA, SAM.gov and the U.S. Census — and from the company’s own website. Federal source data is public domain. Each plant’s page names the source of every field.