Bga Technology LLC
At a glance
EmployeesNot reported
In business sinceNot reported
HeadquartersHolbrook, NY
SAM.gov UEIK7GFWD54VDP7
BGA Test & Technology performs retinning and reballing of Ball Grid Array components, along with robotic hot solder dip, gold embrittlement mitigation, column grid array attach testing, temperature up-screening, programming, component harvesting, and lead forming. The company serves military and aerospace customers. The company holds AS9100D, ISO9001:2015, ANSI/ESD-S20.20-2014, and ITAR Registration certifications.
Summarized from the company’s own website
Certifications
AS9100ISO 9001ITAR registered
Their plant
| Facility | City | State | Employees | Status |
|---|---|---|---|---|
| Bga Technology LLC | Holbrook | NY | — | ACTIVE |
Compiled from federal records — EPA, OSHA, SAM.gov and the U.S. Census — and from the company’s own website. Federal source data is public domain. Each plant’s page names the source of every field.