First Level INC.

Claim this page

Their homepage, crawled JUL 31, 2026

At a glance

EmployeesNot reported

In business sinceNot reported

Industry

Semiconductor and Related Device Manufacturing

HeadquartersYork, PA

SAM.gov UEINTHPEJSM8F95

First Level Inc. is a contract assembly facility specializing in microelectronics packaging. The company performs wire bonding, die attach, flip chip, hermetic lid sealing, BGA, dicing, and testing, operating Class 10,000 ESD protected cleanrooms for these processes. The company holds J-STD-001 and IPC-A-610 certifications for staff.

Facility	City	State	Employees	Status
First Level INC.	York	PA	—	● ACTIVE

Compiled from federal records — EPA, OSHA, SAM.gov and the U.S. Census — and from the company’s own website. Federal source data is public domain. Each plant’s page names the source of every field.