Hybond, INC.
At a glance
EmployeesNot reported
In business sinceNot reported
HeadquartersEscondido, CA
SAM.gov UEIYK91A846N9X1
HYBOND, Inc. manufactures semiconductor bonding equipment, including wire bonders, peg and beam bonders, and die bonders. The company's products use thermosonic, ultrasonic, epoxy, and eutectic bonding processes, and include models such as the 626 Multipurpose Digital Thermosonic Bonder, 676 Digital Wedge Bonder, and EDB-140B Epoxy Die Bonder.
Summarized from the company’s own website
Their plant
| Facility | City | State | Employees | Status |
|---|---|---|---|---|
| Hybond, INC. | Escondido | CA | — | ACTIVE |
Compiled from federal records — EPA, OSHA, SAM.gov and the U.S. Census — and from the company’s own website. Federal source data is public domain. Each plant’s page names the source of every field.


