Pac Tech USA Packaging Technologies, INC
At a glance
EmployeesNot reported
In business sinceNot reported
HeadquartersSanta Clara, CA
SAM.gov UEIKBYMJL8M5119
The company manufactures advanced packaging equipment and provides wafer level bumping services. Its equipment processes include laser soldering, laser assisted bonding, electroless plating, solder ball mounting, and wire soldering, and serves applications such as 3D and 3.5D packaging, flip chip, probe card, reballing, and SMT. The company serves the aerospace, automotive, consumer electronics, energy and solar, and medical industries.
Summarized from the company’s own website
Their plant
| Facility | City | State | Employees | Status |
|---|---|---|---|---|
| Pac Tech USA Packaging Technologies, INC | Santa Clara | CA | — | ACTIVE |
Compiled from federal records — EPA, OSHA, SAM.gov and the U.S. Census — and from the company’s own website. Federal source data is public domain. Each plant’s page names the source of every field.