Pac Tech USA Packaging Technologies, INC
At a glance
EmployeesNot reported
In business sinceNot reported
HeadquartersSanta Clara, CA
SAM.gov UEIKBYMJL8M5119
CAGE code5X0L6
Incorporated inCA
- wafer level bumping
- 3.5D
- level chip scale packaging
- flip chip interconnects
- laser soldering
- laser assisted bonding
- electroless plating
- electroplating
- aerospace
- automotive
- consumer electronics
- medical
Named on the company’s own website, read JUL 29, 2026
CareersCareers page — seen SEP 8, 2026
Supplier designations
For Profit Organization
Self-certified by the company in its SAM.gov registration
Their plant
| Facility | City | State | Employees | Status |
|---|---|---|---|---|
| Pac Tech USA Packaging Technologies, INC | Santa Clara | CA | — | ACTIVE |
Compiled from federal records — EPA, OSHA, SAM.gov and the U.S. Census — and from the company’s own website. Federal source data is public domain. Each plant’s page names the source of every field.


