Product line
CoreEZ Semiconductor Packaging
Made by Ttm Technologies, INC · Sterling, VA
- Rad hard
- yes
- Line space
- 28microns
- Product class
- Printed circuit assemblies, loaded boards and modules (printed circuit boards with inserted electronic components)NAPCS 2033930000
From Ttm Technologies, INC’s own documents · read October 12, 2026 · not verified by FactoryRegistry
Documents
Where this comes from — 1 document
A machine read this from documents Ttm Technologies, INC publishes on its own website, as of October 12, 2026. FactoryRegistry has not verified it; the documents are the authority.
- 3K. HDI Advanced Solutions High Res logo-updated, page 4: “CoreEZ ® semiconductor packaging uses the HyperBGA® manufacturing platform”