Product line · Carried
Electroplating
Carried by Ttm Technologies, INC
- Process
- 电镀
- Material
- 铜锡
- Product class
- Electroplating, plating, polishing, anodizing, pickling, and coloringNAPCS 2053500000
- In the register
- Every plant recorded as making it
From Ttm Technologies, INC’s own documents · read October 12, 2026 · not verified by FactoryRegistry
20 families in Electroplating
Documents
Where this comes from — 6 documents
A machine read this from documents Ttm Technologies, INC publishes on its own website, as of October 12, 2026. FactoryRegistry has not verified it; the documents are the authority.
- TTM Technologies - LTCC Design Guide, page 1: “Electroplating (Ni/Au and Ni/Pb‑Sn)”
- TTM Technologies - LTCC Design Guide: “TTM Technologies - LTCC Design Guide”
- GZ Hidden Hazard Investigation Report 2023, page 51: “覆铜板废气排放包括工艺废气和燃油废气”
- GZ Risk Assessment Report, page 14: “Electroplating processes for PCB manufacturing”
- Toronto Toxics Reduction Plan Summary 2013, page 3: “Nitric Acid 7697-37-2”
- TTM ZS Soil Self-Monitoring Assessment Report, page 21: “新增沉铜生产线 3 条、电镀线 10 条、蚀板生产线 8 条”
- 广州添利电子科技有限公司－土壤污染隐患自查报告2019, page 21: “电镀”