Manufacturing of semiconductor wafer processing equipment, thin layer chemical and physical vapor deposition
NAPCS COLLECTION CODE 2014475003
The U.S. Census Bureau recorded this product line in 1 US manufacturing industry in the 2022 Economic Census, as the most specific line that industry reported, where 67 establishments reported producing it.
That is a count of establishments by industry. It says how many establishments in each industry reported this product line; the Economic Census publishes these figures as industry totals and never as a list of plants. The largest share Census published for any one industry is 39.6% of that industry’s establishments.
Withheld means Census suppressed the figure because publishing it would disclose an individual establishment. The line itself is never suppressed — only the numbers on it.
Facilities in that industry
FactoryRegistry lists 402 facilities whose primary industry classification is one of the 1 industry above. This is a list by industry, not a list of makers: Census reports that establishments in these industries produced semiconductor wafer processing equipment, thin layer chemical and physical vapor deposition, in the shares shown above, and does not say which establishments. Where a plant’s own website or a federal registry names what that plant makes, it appears on the plant’s own page with the source named.
Part of Manufacturing of semiconductor wafer processing equipment, thin layer chemical and physical vapor deposition, plasma etch and other semiconductor equipment and parts
The Economic Census files this product line under Manufacturing of semiconductor wafer processing equipment, thin layer chemical and physical vapor deposition, plasma etch and other semiconductor equipment and parts. These are the other lines it groups:
Source for the product line, the establishment counts and the shares: U.S. Census Bureau, 2022 Economic Census (ECNNAPCSIND2022). Federal source data is public domain. Facility records are compiled separately by FactoryRegistry and carry their own sources.
